Low-Density, One-Component Edge and Void Fillers
Non-flow, off-white epoxy void filler with a 30-day work life at room temperature. Requires elevated temperature cure and can be co-cured with composites in 90 minutes. Used for insert potting and blocks in honeycomb panels.
Non-flow, off-white epoxy void filler with a 30-day work life at room temperature. Requires elevated temperature cure and can be co-cured with composites in 90 minutes. Used for insert potting and blocks in honeycomb panels.
Unit of Measure
Typical Properties
Original Equipment Manufacturer (OEM) Specifications |
N/A Boeing BMS 5-28, Ty 10, REV AN / C&D Aerospace CDM212-00, Ty 13, REV J Heath Tecna C2-001, Ty 2, CLI GRA REV M |
Consistency at 77 Degree Fahrenheit (ºF) Temperature |
N/A Non-flow paste |
Gel Time at 77 Degree Fahrenheit (ºF) Temperature |
N/A 30 days after thaw minutes |
Suggested Cure Schedule Fahrenheit (ºF) |
N/A 1 hr at 260 ºF |
Maximum Service Temperature |
N/A Not Determined |
Compressive Strength at 77 Fahrenheit (ºF) |
N/A 2400 psi |
Flame Retardant |
N/A Yes |
Packaging |
N/A Working packs and pails |
