Items |
CG 1305 A/B CG 1305 A/B High-Strength Edge and Void Filler |
Epocast 1610-A1 Epocast® 1610-A1 Flame Retardant Void Filler |
Epocast 1614-A2 Epocast® 1614-A2 High-Compressive Strength Edge and Void Filler |
Epocast 1617 A/B Epocast® 1617 A/B Flame Retardant Edge and Void Filler |
Epocast 1618 D/B Epocast® 1618 D/B Fast-Setting Edge and Void Filler |
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Description |
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Medium-Density, Two-Component Edge and Void Fillers Flame-retardant, pourable off-white epoxy edge and void filler that cures at room temperature. Used for reinforcing high-stress areas in honeycomb and other potting applications. |
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Low-Density, One-Component Edge and Void Fillers Non-flow, off-white epoxy void filler with a 30-day work life at room temperature. Requires elevated temperature cure and can be co-cured with composites in 90 minutes. Used for insert potting and blocks in honeycomb panels. |
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Medium-Density, One-Component Frozen Edge and Void Fillers Thixotropic, reddish-brown structural epoxy edge and void filler with high-compressive strength. Requires an elevated temperature cure. Used for reinforcing honeycomb core and panel edges for high-service temperatures. Also available as a Eposert™ pre-cured insert. |
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Low-Density, Two-Component Edge and Void Fillers Low-Density, Two-Component Edge and Void Fillers Low-density, room-temperature cure, off-white epoxy paste produces flame retardant, high strength edge seals on honeycomb composite structures. |
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Low-Density, Two-Component Edge and Void Fillers Flame-retardant, low-flow, extrudable, off-white epoxy edge and void filler with good compressive strength that cures at room temperature. Suitable for insert potting in honeycomb structures. |
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Original Equipment Manufacturer (OEM) Specifications | N/A Boeing BMS 5-28, Ty 7, Cl 1, REV AN / Spirit SMS 116201, Ty 1, REV H /Alenia MDL8027, Ty 7, REV 1 | N/A Boeing BMS 5-28, Ty 10, REV AN / C&D Aerospace CDM212-00, Ty 13, REV J Heath Tecna C2-001, Ty 2, CLI GRA REV M | N/A For complete list please see page 14 | N/A Boeing BMS 5-28, Ty 17, REV AN / ROHR RMS 027, Ty 5, Cl 3, REV AP SCO 036/Bombardier SMS 41, Ty 3, Iss 6 / Gamesa GMS 124047 Iss 3 / Alenia MDL08055 REV 1 / Kaman CMS-007-4, REV IR / Piaggo NP190112, Ty 17, REV C | N/A Boeing BMS 5-28, Ty 18, Cl 1, REV AN | |||||
Consistency at 77 Degree Fahrenheit (ºF) Temperature | N/A Pourable | N/A Non-flow paste | N/A Extrudable paste | N/A Paste | N/A Paste | |||||
Gel Time at 77 Degree Fahrenheit (ºF) Temperature | N/A >60 (60 gram mass) minutes | N/A 30 days after thaw minutes | N/A 8 hrs after thaw minutes | N/A 60-90 (60 gram mass) minutes | N/A 15 (57 gram mass) minutes | |||||
Mix Ratio by Weight (R:H) | N/A 100:20 | N/A | N/A | N/A 100:20 | N/A 100:14 | |||||
Suggested Cure Schedule Fahrenheit (ºF) | N/A 7 days at 77 ºF or 1 hr at 350 ºF | N/A 1 hr at 260 ºF | N/A 1 hr at 350 ºF or 1.5 hrs at 250 ºF | N/A 7 days at 77 ºF or 5 hrs at 125 ºF | N/A 7 days at Room Temp or 5 hrs at 125 ºF | |||||
Note for Suggested Cure Schedule | N/A Cure may be accelerated with heat. | N/A | N/A | N/A | N/A | |||||
Maximum Service Temperature | N/A 350 ºF | N/A Not Determined | N/A 350 ºF | N/A Not Determined | N/A Not Determined | |||||
Compressive Strength at 77 Fahrenheit (ºF) | N/A 9000 psi | N/A 2400 psi | N/A 14500 psi | N/A 5500 psi | N/A 5000 psi | |||||
Density | N/A 0.90 g/cm³ | N/A 0.50 g/cm³ | N/A 0.75 g/cm³ | N/A 0.70 g/cm³ | N/A 0.70 g/cm³ | |||||
Flame Retardant | N/A Yes | |||||||||
Packaging | N/A 50g and 500g jar kits, 6 oz Semkits® and working packs | N/A Working packs and pails | N/A 6 oz, 12 oz and 20 oz cartridges and patties | N/A Working packs | N/A 6 oz Semkits®, working packs and pail kits | |||||
Mix Ratio Ritt by Weight | N/A | |||||||||
Mixed Viscosity at 77 Fahrenheit (ºF) Temperature | N/A | |||||||||
Minimum Gel Time/Pot Life at 77 Fahrenheit (ºF) Temperature | N/A | |||||||||
Nominal Service Temperature | N/A | |||||||||
Laminate Compressive Strength at 77 Fahrenheit (ºF) Temperature | N/A | |||||||||
Color | N/A Off-White | N/A Off-White | N/A Red-Brown | N/A Off-White | N/A Off-White | |||||
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